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Wafer 두께측정기 본문

측정/계측/검사/시험기

Wafer 두께측정기

여기에 2015. 1. 9. 10:45
제품코드G050141[G050141] Wafer 두께측정기
판매 회사명냅슨코리아
연락처02-3432-1008
홈페이지-
제품홍보관http://blog.yeogie.com/napson
Wafer 두께측정기

Wafer 두께측정기

특징

-Thickness : 200 ?1200μm / Bow : +/-350μm / Warp : 350μm
- Applications : Semiconductor materilas, Solar-cell materials (Silicon, Polysilicon, SiC etc)
                    Silicon-related epitaxial materials, Ion-implantation sample
                    Chemical compound semiconductor (GaAs Epi, GaN Epi, InP, Ga etc) 
- Sample sizes : 3~8 inch


상세설명

- Measures Thickness, TTV, Bow, Warp and site and global Flatness (ASTM compliance)

- Measures all materials including Si, GaAs, Ge, InP, SiC

- Full 500 micron thickness measurement range without re-calibration

- 2-D /3-D Mapping software

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